Methods to remove an EBC from a substrate and to repair a coated component
AssigneeGeneral Electric Company
InventorsAnant Achyut Setlur, Julin Wan, Andrea Vozar, James Edward Murphy
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Abstract
A method is provided for removing an environmental barrier coating from a coated component. The method may include contacting the coated component with an etchant liquid that comprises 5% by volume to 70% by volume of hydrogen fluoride and a solvent. The hydrogen fluoride reacts with silicon oxide in a thermally grown oxide layer positioned between a bondcoat and the environmental barrier coating. The bondcoat is positioned within the coated component between a silicon-containing substrate and the thermally grown oxide layer, and the bondcoat comprises a silicon-containing material.
Claims20
A method for removing an environmental barrier coating from a coated component that includes a silicon-containing substrate, a bondcoat on the silicon-containing substrate and comprising a silicon-containing material, an environmental barrier coating on the bondcoat, and a thermally grown oxide layer positioned between the bondcoat and the environmental barrier coating, the method comprising:
- contacting the coated component with an etchant liquid comprising 5% by volume to 70% by volume of hydrogen fluoride and a solvent, wherein the hydrogen fluoride reacts with silicon oxide in the thermally grown oxide layer to thereby remove the thermally grown oxide layer and the environmental barrier coating from the bondcoat.
Dependencies are inferred from the claim text.