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AssigneesCommissariat A L'energie Atomique Et Aux Energies Alternatives, Soitec
InventorsMarilyne Roumanie, Christelle Navone, Sébastien Quenard, Didier Landru, Christelle Veytizou
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A method for producing a multilayer structure includes the following steps: a) providing a first substrate, b) depositing a thick layer of a precursor formulation including a preceramic polymer filled with inorganic particles on the first substrate, c) providing a second substrate, d) adhesively bonding the thick layer and the second substrate, e) thinning the first substrate or the second substrate so as to obtain an active layer, f) applying a pyrolysis heat treatment so as to ceramize the preceramic polymer of the thick layer and to obtain a ceramic matrix composite material, the filler content and the nature of the inorganic particles being chosen so that the thick layer has a coefficient of thermal expansion which differs, at most, by 15% from that of the first substrate and from that of the second substrate.
A method for producing a multilayer structure intended for applications in the field of microelectronics, the method comprising the following steps:
A multilayer structure intended for applications in microelectronics, the multilayer structure comprising a thick layer disposed between an active layer and a support substrate consisting of one amongst a first substrate and a second substrate, the active layer originating from thinning of the other one amongst the first substrate and the second substrate, the thick layer comprising a composite material including a ceramic matrix and inorganic particles, the nature and the charge rate of inorganic particles being selected so that the thick layer has a CTE which differs at most by 15% from the CTE of the material of the support substrate and that of the active layer.
Dependencies are inferred from the claim text.