Multilayer structure, and packaging material for retort using same
AssigneeKuraray Co., Ltd.
InventorKentaro Yoshida
Life of this patent
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Abstract
There is provided a multilayer structure comprising at least a barrier resin layer (X) and an inorganic barrier layer (Y) with a thickness of 500 nm or less which is adjacent to the barrier resin layer (X), wherein the layer (X) is made of a resin composition (x) comprising an ethylene-vinyl alcohol copolymer (A) and a polyamide (B) in a mass ratio (A/B) of 55/45 to 98/2, and the ethylene-vinyl alcohol copolymer (A) has an ethylene content of 20 to 46 mol % and a saponification degree of 90 mol % or more. Thus, there can be provided a multilayer structure having excellent gas barrier properties and appearance even after being subjected to stretching process or retorting process followed by bending process, and a packaging material for retort therewith.
Claims18
A multilayer structure comprising at least a barrier resin layer (X) and an inorganic barrier layer (Y) with a thickness of 500 nm or less which is adjacent to the barrier resin layer (X), wherein
- the layer (X) comprises a resin composition (x) made from an ethylene-vinyl alcohol copolymer (A), a polyamide (B), and a multivalent metal ion (C), in which a mass ratio of A to B (A/B) is 55/45 to 98/2;
- the resin composition (x) comprises from 20 to 400 ppm of the multivalent metal ion (C);
- the multivalent metal ion (C) comprises at least one multivalent metal ion selected from the group consisting of magnesium, calcium and zinc;
- the multivalent metal ion (C) is contained as a hydroxide;
- and
- the ethylene-vinyl alcohol copolymer (A) has an ethylene content of 20 to 46 mol % and a saponification degree of 90 mol % or more.
Dependencies are inferred from the claim text.