Processing machine and unloading method of workpiece
AssigneeDisco Corporation
InventorJiro Genozono
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AssigneeDisco Corporation
InventorJiro Genozono
Estimating the term…
A processing machine has a holding unit, which includes a holding surface, a suction valve, an air ejection valve, a water ejection valve, a plurality of suction openings, and a suction-openings suction valve that establishes or interrupts communication between the suction openings and a suction source. An unloading method of a wafer in the processing machine includes a separation step of separating the wafer from the holding surface by closing the suction valve and opening the air ejection valve and the water ejection valve such that a mixed fluid of air and water is supplied to the holding surface, and an unloading step of unloading, from the holding surface, the wafer separated from the holding surface. The separation step includes a drawing step of opening the suction-openings suction valve and drawing the mixed fluid outside of the holding surface.
A processing machine comprising:
An unloading method of a workpiece for unloading the workpiece, the workpiece being held under suction on a holding surface of a holding unit communicating with a suction source, from the holding surface, with use of a processing machine,
Dependencies are inferred from the claim text.