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US 12,616,991 B2Granted
Ultrasonic atomization apparatus
AssigneeTmeic Corporation
InventorsHiroyuki Orita, Takahiro Hiramatsu
Life of this patent
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Abstract
In an ultrasonic atomization apparatus being the present invention, a source solution is accommodated in a separator cup being a part of a container. A constituent material of the separator cup is PTFE being one of fluorocarbon resins, whose entire thickness is uniformly 0.5 mm. Therefore, the separator cup satisfies a thin film condition that “the thickness of a bottom surface BP1 is 0.5 mm or less”.
Claims5
An ultrasonic atomization apparatus comprising:
- a container including a separator cup configured to accommodate a source solution at a lower part;
- an internal hollow structure body including a hollow inside being provided above said separator cup in said container;
- a water tank configured to accommodate an ultrasonic wave conveyance medium inside, said water tank and said separator cup being positioned so that a bottom surface of said separator cup is immersed in said ultrasonic wave conveyance medium;
- and
- a plurality of ultrasonic vibrators provided in a bottom surface of said water tank, wherein
- said separator cup uses fluorocarbon resin as a constituent material,
- said separator cup is integrally formed by a cylindrical side surface and a bottom surface without a joint member, said bottom surface of said separator cup is inclined from a bottom end of said cylindrical side surface toward a center of said bottom surface of said separator cup, and is formed into a spherical surface shape having a predetermined curvature,
- said bottom surface of said separator cup includes a plurality of thin film regions corresponding to said plurality of ultrasonic vibrators, and each of said plurality of thin film regions includes an ultrasonic wave transmission region allowing transmission of ultrasonic waves applied from a corresponding ultrasonic vibrator out of said plurality of ultrasonic vibrators,
- in said bottom surface of said separator cup, said plurality of thin film regions satisfy a first thin film condition, and other region except for said plurality of thin film regions does not satisfy said first thin film condition,
- in said bottom surface of said separator cup, each of said plurality of thin film regions has a recess at a contact side contacting said source solution and does not have a recess at a contact side contacting said ultrasonic wave conveyance medium,
- said first thin film condition is that said thickness of said plurality of thin film regions in said bottom surface is 0.5 mm or less,
- entire thickness of said separator cup including the cylindrical side surface and the bottom surface other than said plurality of thin film regions is uniform and satisfying a second thin film condition, and
- said second thin film condition is that the entire thickness of said separator cup other than said plurality of thin film regions is larger than 0.5 mm.
10 more elements
Dependencies are inferred from the claim text.