Mattress assembly with reduced heat index
AssigneeDreamwell, Ltd.
InventorChristopher Francis Chunglo
Life of this patent
Estimating the term…
Abstract
Mattress assemblies that provide reduced heat index during use include a thermally conductive layer and a spacer layer and in direct contact with the thermally conductive layer. Optionally, the thermally conductive foam layer can be perforated. In some embodiments, the thermally conductive layer and the spacer layer can overlay an innerspring mattress core, one or more foam layers, or a hybrid of foam and innersprings. In other embodiments, the mattress assemblies include a foam layer such as a viscoelastic foam layer overlying the thermally conductive layer and the spacer layer. Also, disclosed are processes for reducing the heat index in a mattress assembly.
Claims21
A mattress assembly, comprising:
- an upper foam layer;
- a thermally conductive layer underlying and in direct contact with the upper foam layer;
- and
- a spacer layer underlying and in direct contact with the thermally conductive layer, wherein the spacer layer comprises a three-dimensional polymeric fibrous structure including substantially planar top and bottom polymeric fiber mesh surfaces including a plurality of openings and substantially vertically oriented filaments extending between the planar top and bottom polymeric fiber mesh surfaces, wherein the spacer layer has a free volume of at least 50% and is formed of monofilament polyester fibers having a diameter selected to provide a desired compression response, wherein the spacer layer maintains a percentage of free volume such that air flow though the layer is maintained under compression, and wherein the thermally conductive layer is perforated and cooperates with the spacer layer to maintain airflow under load.
A mattress assembly, comprising:
- a thermally conductive layer proximate to a sleeping surface, the thermally conducive foam layer comprising thermally conductive particles within a foam matrix;
- and
- a spacer layer underlying and in direct contact with the thermally conductive layer, wherein the spacer layer comprises a three-dimensional polymeric fibrous structure consisting of substantially planar top and bottom polymeric mesh surfaces including a plurality of openings and substantially vertically oriented filaments extending between the planar top and bottom surfaces, wherein the filaments have a smaller diameter than the fibers in the top and bottom polymeric mesh surfaces, wherein the spacer layer has a free volume of at least 50%, and wherein the spacer layer is formed of monofilament polyester fibers having a diameter selected to provide a desired compression response, wherein the spacer layer maintains a percentage of free volume such that air flow though the layer is maintained under compression, and wherein the thermally conductive layer is perforated and cooperates with the spacer layer to maintain airflow under load.
A process for reducing heat index in a mattress assembly, the process comprising:
- placing a spacer layer under and in direct contact with a thermally conductive layer within a mattress assembly, wherein the spacer layer comprises a three-dimensional polymeric structure of fibers consisting of planar top and bottom polymeric fiber mesh surfaces including a plurality of openings and filaments vertically extending from the bottom to the top surfaces, wherein the thermally conductive layer comprises a thermally conductive material having a thermal conductivity greater than 5 watts per meters-Kelvin, wherein the spacer layer has a free volume of at least 50%, and wherein the spacer layer is formed of monofilament polyester fibers having a diameter selected to provide a desired compression response, wherein the spacer layer maintains a percentage of free volume such that air flow though the layer is maintained under compression, and wherein the thermally conductive layer is perforated and cooperates with the spacer layer to maintain airflow under load.
Dependencies are inferred from the claim text.