Semiconductor package including a semiconductor chip on a redistribution substrate and conductive structure spaced apart from the semiconductor chip

A semiconductor package comprising:

• a first redistribution substrate;
• a semiconductor chip on a top surface of the first redistribution substrate;
• a conductive structure on the top surface of the first redistribution substrate and spaced apart from the semiconductor chip;
• a molding layer on the first redistribution substrate and on a side surface of the semiconductor chip and a side surface of the conductive structure;
• and
• a second redistribution substrate on the molding layer and the conductive structure and connected to the conductive structure,
• wherein the conductive structure comprises:
• a first conductive structure connected to the first redistribution substrate;
• and
• a second conductive structure on the first conductive structure,
• wherein the second conductive structure includes nickel,
• wherein a top surface of the second conductive structure is coplanar with a top surface of the molding layer,
• wherein the second redistribution substrate comprises an insulating layer, and
• wherein the insulating layer directly contacts at least a portion of the top surface of the second conductive structure and at least a portion of the top surface of the molding layer.

A semiconductor package comprising:

• a first redistribution substrate comprising a first insulating layer and a first redistribution pattern;
• a solder ball on a bottom surface of the first redistribution substrate;
• a semiconductor chip on a top surface of the first redistribution substrate;
• a conductive structure on the first redistribution substrate and laterally spaced apart from the semiconductor chip;
• a seed pattern disposed between the first redistribution substrate and the conductive structure;
• a molding layer on the first redistribution substrate and on the semiconductor chip, the molding layer on a side surface of the conductive structure and exposing a top surface of the conductive structure;
• and
• a second redistribution substrate on the molding layer and connected to the conductive structure,
• wherein the second redistribution substrate comprises a second insulating layer and a second redistribution pattern,
• wherein the conductive structure comprises:
• a first conductive structure on the top surface of the first redistribution substrate;
• and
• a second conductive structure on a top surface of the first conductive structure,
• wherein the second insulating layer comprises a photosensitive polymer,
• wherein the second conductive structure comprises nickel (Ni), and
• wherein the second insulating layer directly contacts at least a portion of a top surface of the second conductive structure and at least a portion of a top surface of the molding layer.