Double-sided cooling package for double-sided, bi-directional junction transistor
AssigneeIdeal Power Inc.
InventorsJiankang Bu, Robert Daniel Brdar
Life of this patent
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Abstract
A double-sided cooling package for a double-sided, bi-directional junction transistor can include a double-sided, bi-directional, junction transistor chip with an individual, double-sided, bi-directional power switch (collectively, a DSTA). The DSTA can be sandwiched between heat sinks. Each heat sink can include a direct plating copper (DPC) structure, a direct copper bonding (DCB) structure or a direct aluminum bond (DAB) structure. In addition, each heat sink can have opposed first and second copper layers on a substrate, and copper contacts that extend from a respective second copper layer through vias in each substrate to an exterior of the cooling package.
Claims25
A cooling package for double-sided chips, the cooling package comprising:
- a double-sided, bi-directional, junction transistor chip with an individual, double-sided, bi-directional power switch (DSTA);
- and
- first and second heat sinks, wherein the first and second heat sinks are arranged on opposing sides of the DSTA such that the DSTA is sandwiched between the first and second heat sinks, each of the first and second heat sinks comprising (i) a direct plating copper (DPC) structure having opposed first and second copper layers on a substrate, and (ii) copper contacts that extend from the second copper layer through vias in the substrate to an exterior of the cooling package,
- wherein the DPC structures are symmetrical to one another across the DSTA.
A cooling package for double-sided chips, the cooling package comprising:
- a double-sided, bi-directional, junction transistor chip with an individual, double-sided, bi-directional power switch (DSTA);
- and
- first and second heat sinks, wherein the first and second heat sinks are arranged on opposing sides of the DSTA such that the DSTA is sandwiched between the first and second heat sinks, each of the first and second heat sinks comprising (i) a direct copper bonding (DCB) structure having opposed first and second copper layers on a substrate, and (ii) copper contacts that extend from the second copper layer through vias in the substrate to an exterior of the cooling package,
- wherein the DCB structures are symmetrical to one another across the DSTA.
A cooling package for double-sided chips, the cooling package comprising:
- a double-sided, bi-directional, junction transistor chip with an individual, double-sided, bi-directional power switch (DSTA);
- and
- first and second heat sinks, wherein the first and second heat sinks are arranged on opposing sides of the DSTA such that the DSTA is sandwiched between the first and second heat sinks, each of the first and second heat sinks comprising (i) a direct aluminum bond (DAB) structure having opposed first and second aluminum layers on a substrate, and (ii) aluminum contacts that extend from the second aluminum layer through vias in the substrate to an exterior of the cooling package,
- wherein the DAB structures are symmetrical to one another across the DSTA.
Dependencies are inferred from the claim text.