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US 12,616,067 B2Granted
Electronic package and manufacturing method thereof
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsMeng-Jie Lee, Chih-Nan Lin, Ci-Hong Yan, Nai-Hao Kao
Life of this patent
Estimating the term…
Abstract
An electronic package is provided, in which an electronic module including a first electronic element and a second electronic element is disposed on a carrier structure embedded with a third electronic element, and the third electronic element is a photonic chip electrically connected to the electronic module. Therefore, with this configuration, it is beneficial to reduce a layout area of the carrier structure to meet the requirement of miniaturization.
Claims16
An electronic package, comprising:
- a carrier structure;
- an electronic module disposed on the carrier structure, wherein the electronic module comprises an encapsulation layer having a first surface and a second surface opposing the first surface, a first electronic element embedded in the encapsulation layer, conductive pillars embedded in the encapsulation layer, a circuit structure disposed on the first surface of the encapsulation layer and electrically connected to the first electronic element and the conductive pillars, and at least two second electronic elements disposed on and electrically connected to the circuit structure, wherein the first electronic element is electrically connected to the at least two second electronic elements to serve as a bridge die, and a redistribution layer including an insulating layer and a routing structure is formed on a bottom side of the bridge die;
- and
- a third electronic element embedded in the carrier structure and electrically connected to the electronic module, wherein the third electronic element is a photo IC, wherein the third electronic element is partially exposed from the carrier structure and the electronic module, and the exposed third electronic element is connected to an optical fiber disposed on the carrier structure.
1 more element
A method of manufacturing an electronic package, comprising:
- providing an electronic module, wherein the electronic module comprises an encapsulation layer having a first surface and a second surface opposing the first surface, a first electronic element embedded in the encapsulation layer, conductive pillars embedded in the encapsulation layer, a circuit structure disposed on the first surface of the encapsulation layer and electrically connected to the first electronic element and the conductive pillars, and at least two second electronic elements disposed on and electrically connected to the circuit structure, wherein the first electronic element is electrically connected to the at least two second electronic elements to serve as a bridge die, and a redistribution layer including an insulating layer and a routing structure is formed on a bottom side of the bridge die;
- electrically connecting a third electronic element to the electronic module, wherein the third electronic element is a photo IC;
- and
- disposing the electronic module on a carrier structure, wherein the third electronic element is embedded in the carrier structure, wherein the third electronic element is partially exposed from the carrier structure and the electronic module, and the exposed third electronic element is connected to an optical fiber disposed on the carrier structure.
1 more element
Dependencies are inferred from the claim text.