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US 12,616,062 B2Granted
Device assembly, device module including the device assembly, and device package including the device module
AssigneesKorea Institute of Science and Technology, Research & Business Foundation Sungkyunkwan University
InventorsIn Soo Kim, Donghee Son, Hannah Kwon, Hye Jun Kim, Duhwan Seong, Jinhyun Kim
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Abstract
Provided is a device assembly including a substrate for mounting a device thereon, electrodes provided on the substrate to be electrically connected to the device, and an encapsulation provided on the substrate and the electrodes to accommodate and encapsulate the device therein, wherein the substrate and the encapsulation are made of a self-healing polymer (SHP), and wherein the electrodes are made of a conductive polymer composite including the SHP.
Claims5
A device assembly comprising:
- a substrate on which a device is mounted;
- electrodes provided on the substrate and electrically connected to the device;
- and
- an encapsulation provided on the substrate, the device, and the electrodes, the encapsulation covering the device to accommodate and encapsulate the device therein,
- wherein the substrate and the encapsulation are made of a self-healing polymer (SHP),
- wherein the electrodes are made of a conductive polymer composite comprising the SHP, and
- wherein the device includes a light-receiving device, or a light-emitting device, or both.
4 more elements
Dependencies are inferred from the claim text.