Double-sided sip packaging structure having interposer including a groove and manufacturing method thereof

A manufacturing method of the double-sided SiP packaging structure, comprising the following steps:

• S1:
• providing a substrate, wherein the substrate comprises a plurality of substrate units, and forming a first packaging structure on an upper surface of each substrate unit;
• S2:
• providing a plurality of chips, and a functional surface of at least one chip of the plurality of chips bonded on a lower surface of each substrate unit with solder balls;
• S3:
• providing at least one interposer, wherein the at least one interposer comprises a plurality of interposer units, and a conductive bonding pad array is arranged on a lower surface of each of the plurality of interposer units;
• and forming a groove in a part of region between the conductive bonding pad array and an edge contour of each of the plurality of the interposer units;
• S4:
• manufacturing and forming a conductive structure array on an upper surface of each of the plurality of interposer units, and an upper surface of the at least one interposer bonded to a part of region below the substrate with the conductive structure array;
• and
• S5:
• providing molding materials, filling a space region among a lower surface of the substrate, the plurality of chips and the at least one interposer with the molding materials, and forming a second packaging structure on the lower surface of each substrate unit.