Semiconductor device and method for making the same

A method for making a semiconductor device, comprising:

• providing a package comprising:
• a substrate comprising a first surface and a second surface opposite to the first surface;
• a first electronic component mounted on the first surface of the substrate;
• a second electronic component mounted on the second surface of the substrate;
• a contact pad formed on the second surface of the substrate, wherein the contact pad is outside of a projection of the second electronic component on the second surface of the substrate;
• and
• a first encapsulant disposed on the first surface of the substrate and covering the first electronic component;
• forming a second encapsulant over and around the second electronic component, wherein the contact pad is exposed from the second encapsulant;
• planarizing the second encapsulant to expose the second electronic component;
• and
• forming a bump on the contact pad of the second surface of the substrate,
• wherein forming a second encapsulant over and around the second electronic component comprises:
• providing a mold having a Ω-shape, the mold comprising a chamber, an opening in fluid communication with the chamber, and a peripheral plate;
• attaching the mold onto the second surface of the substrate with the second electronic component accommodated in the chamber and the contact pad covered by the peripheral plate;
• and
• depositing the second encapsulant into the chamber through the opening, wherein the second encapsulant flows through the opening to cover the second electronic component and a portion of the second surface of the substrate.