Methods a sequence for a plurality of wire loops in connection with a workpiece

A method of determining a sequence for creating a plurality of wire loops in connection with a workpiece, the method comprising the steps of:

• (a) providing workpiece data for the workpiece, the workpiece data including (i) position data for bonding locations of the workpiece, and (ii) wire loop data for the plurality of wire loops providing interconnection between ones of the bonding locations of the workpiece, the wire loop data including a three-dimensional shape of each of the plurality of wire loops;
• (b) analyzing each of the plurality of wire loops to be created using the workpiece data, the step of analyzing including substeps of (b1) checking each of the plurality of wire loops for overlap conditions with others of the plurality of wire loops, (b2) checking a height of each of the plurality of wire loops with respect to others of the plurality of wire loops, (b3) checking each of the plurality of wire loops for lateral bend conditions with respect to others of the plurality of wire loops, and (b4) checking a position of each of the wire loops with respect to others of the plurality of wire loops, wherein step (b) includes analyzing the workpiece data by prioritizing substeps (b1)-(b4) with respect to each other;
• and
• (c) providing the sequence of creating the plurality of wire loops in connection with the workpiece at least partially based on the results of step (b),
• wherein the workpiece includes a semiconductor die, and wherein the sequence includes forming ones of the plurality of wire loops being bonded to an outer pad tier of the semiconductor die prior to forming others of the plurality of wire loops being bonded to an inner pad tier of the semiconductor die.