Method of fabricating a semiconductor package including an interposer
AssigneeSamsung Electronics Co., Ltd.
InventorsJu Hyung Lee, Dong Uk Kwon, Sun Chul Kim, Yong Hyun Kim, Min Jae Lee
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Abstract
A method of fabricating a semiconductor package includes disposing a preliminary semiconductor package on a stage, the preliminary semiconductor package including a substrate to which a pad part is attached, an interposer disposed on the substrate, and a semiconductor chip disposed between the substrate and the interposer. A bonding tool is disposed on the interposer. The bonding tool includes a first region and a second region outside of the first region. The second region of the bonding tool corresponds to the pad part. The interposer and the substrate are bonded to each other.
Claims17
A method of fabricating a semiconductor package, comprising:
- disposing a preliminary semiconductor package on a stage, the preliminary semiconductor package including a substrate to which a pad part is attached, an interposer disposed on the substrate, and a semiconductor chip disposed between the substrate and the interposer;
- disposing a bonding tool on the interposer, the bonding tool including a first region and a second region outside of the first region, the first region and the second region being adjacent regions of a single flat plate structure;
- and
- disposing the second region of the bonding tool so as to correspond to the pad part and bonding the interposer and the substrate to each other;
- wherein the pad part includes a pair of first pad parts facing each other in a first direction and a pair of second pad parts facing each other in a second direction, and
- wherein the pair of first pad parts have a height different from that of the pair of a second pad parts.
A method of fabricating a semiconductor package, comprising:
- disposing a preliminary semiconductor package on a stage, the preliminary semiconductor package including a substrate to which a pad part is attached, an interposer disposed on the substrate, and a semiconductor chip disposed between the substrate and the interposer;
- disposing a bonding tool on the interposer, the bonding tool including a first region and a second region outside the first region;
- and
- disposing the second region of the bonding tool so as to correspond to the pad part and bonding the interposer and the substrate to each other,
- wherein the bonding tool further includes a protrusion part formed in the second region and protruding from the bonding tool,
- wherein the protrusion part is in contact with the pad part,
- wherein the bonding tool extends in each of a first direction and a second direction crossing the first direction,
- wherein the protrusion part includes a pair of first protrusion parts facing each other in the first direction and a part of second protrusion parts facing each other in the second direction,
- wherein the pair of the first protrusion parts have the same height as each other, and the pair of second protrusion parts have the same height as each other,
- wherein the pad part includes a pair of first pad parts facing each other in the first direction and a part of second pad parts facing each other in the second direction,
- wherein the pair of first pad parts correspond to the pair of first protrusion parts, and the pair of second pad parts correspond to the pair of second protrusion parts, and
- wherein the pair of first pad parts have a height different from that of the pair of a second pad parts.
A method of fabricating a semiconductor package, comprising:
- disposing a preliminary semiconductor package on a stage, the preliminary semiconductor package including a substrate having a recess formed therein, an interposer disposed on the substrate, and a semiconductor chip disposed between the substrate and the interposer;
- disposing a bonding tool on the interposer, the bonding tool including a first region and a second region outside of the first region, the first region and the second region being adjacent regions of a single flat plate structure;
- and
- disposing the second region of the bonding tool so as to correspond to the recess and bonding the interposer and the substrate to each other;
- wherein the substrate includes a pad part and the pad part includes a pair of first pad parts facing each other in a first direction and a pair of second pad parts facing each other in a second direction, and
- wherein the pair of first pad parts have a height different from that of the pair of a second pad parts.
Dependencies are inferred from the claim text.