Semiconductor package and method of fabricating the same

A semiconductor package, comprising:

• a wiring structure that includes a first insulating layer and a first conductive pattern inside the first insulating layer;
• a first semiconductor chip disposed on the wiring structure;
• an interposer disposed on the first semiconductor chip, wherein the interposer includes a second insulating layer, a second conductive pattern inside the second insulating layer, and a multi-stage recess formed on a first surface of the interposer, wherein the multi-stage recess includes a first stage recess that has a first width, and a second stage recess that is connected to the first stage recess and that has a second width greater than the first width;
• a first element bonded to the interposer inside the multi-stage recess and that faces the first semiconductor chip;
• and
• a first bump connected to the first element positioned in the first stage recess,
• wherein a shortest distance from an upper surface of the second stage recess to an upper surface of the first semiconductor chip is less than or equal to a distance from the first element to the upper surface of the first semiconductor chip, and
• wherein the interposer further includes a protrusion that protrudes from the first surface toward the first semiconductor chip.

A semiconductor package, comprising:

• a wiring structure that includes a first insulating layer and a first conductive pattern inside the first insulating layer;
• a first semiconductor chip disposed on the wiring structure;
• an interposer disposed on the first semiconductor chip, wherein the interposer includes a second insulating layer, a second conductive pattern inside the second insulating layer, and a first recess formed on a first surface of the interposer that faces the first semiconductor chip;
• a first element disposed inside the first recess and bonded to the interposer, wherein the first element faces the first semiconductor chip;
• and
• a mold layer that fills the first recess and integrally covers a side of the first element,
• wherein the interposer further includes a second recess formed along a surface of a protrusion that protrudes from the first surface of the interposer.