Semiconductor packages and methods of manufacturing the same

A semiconductor package, comprising:

• a first redistribution wiring layer including first redistribution wirings;
• a semiconductor chip on the first redistribution wiring layer and electrically connected to the first redistribution wirings;
• a base substrate on the first redistribution wiring layer, wherein the base substrate at least partially surrounds the semiconductor chip;
• and
• a second redistribution wiring layer on the base substrate so that the base substrate and the semiconductor chip are between the first redistribution wiring layer and the second redistribution wiring layer, the second redistribution wiring layer including a sealing layer on the semiconductor chip, second redistribution wirings electrically connected to a conductive structure of the base substrate, and a bonding pad on a redistribution pad of the second redistribution wiring, wherein the bonding pad includes
• a first plating pattern on the redistribution pad, the first plating pattern including a base portion having a diameter that is less than a diameter of the redistribution pad and an edge portion protruding from the base portion to at least partially surround an outer surface of the base portion, wherein the edge portion has an inclined sidewall such that a diameter of the edge portion decreases with increasing distance from the base substrate,
• a second plating pattern on the first plating pattern, and
• a third plating pattern on the second plating pattern.

An electronic package, comprising:

• a redistribution wiring layer including redistribution wiring with a redistribution pad;
• and
• a bonding pad on the redistribution pad of the redistribution wiring, wherein the bonding pad includes
• a first plating pattern on the redistribution pad, wherein the first plating pattern comprises a first material, wherein the first plating pattern has an inclined sidewall so that a diameter of the first plating pattern decreases with increasing distance from the redistribution pad, and so that a first diameter of the first plating pattern adjacent the redistribution pad is greater than a second diameter of the first plating pattern spaced apart from the redistribution pad,
• a second plating pattern on the first plating pattern, wherein the second plating pattern comprises a second material different than the first material, and
• a third plating pattern on the second plating pattern, wherein the third plating pattern comprises a third material different than the second material, wherein the second and third plating patterns have a same diameter that is no greater than the second diameter of the first plating pattern.