Package comprising integrated devices with inner and outer solder interconnects

A package comprising:

• a substrate comprising at least one dielectric layer and a plurality of interconnects;
• a first integrated device comprising a first inner portion and a first perimeter portion that laterally surrounds the first inner portion,
• wherein the first integrated device comprises at least one logical block comprising a plurality of transistors,
• wherein the at least one logical block vertically overlaps with the first inner portion,
• wherein the first integrated device is coupled to the substrate through a first plurality of solder interconnects, wherein the first plurality of solder interconnects include a first plurality of inner solder interconnects and a first plurality of perimeter solder interconnects;
• and
• a second integrated device comprising a second inner portion and a second perimeter portion that laterally surrounds the second inner portion,
• wherein the second integrated device is coupled to the substrate through a second plurality of solder interconnects,
• wherein the first integrated device is configured to be electrically coupled to the second integrated device through an electrical path,
• wherein the electrical path is for input/output signals between the first integrated device and the second integrated device,
• wherein the first plurality of inner solder interconnects include a first plurality of first inner solder interconnects and a second plurality of first inner solder interconnects,
• wherein the first plurality of inner solder interconnects vertically overlap with the first inner portion of the first integrated device,
• wherein adjacent first inner solder interconnects from the first plurality of first inner solder interconnects comprise a first spacing,
• wherein adjacent first inner solder interconnects from the second plurality of first inner solder interconnects comprise a second spacing that is greater than the first spacing,
• wherein the second plurality of first inner solder interconnects laterally surround the first plurality of first inner solder interconnects,
• wherein the electrical path between the first integrated device and the second integrated device comprises a first inner solder interconnect from the first plurality of first inner solder interconnects, at least one interconnect from the plurality of interconnects of the substrate, and a solder interconnect from the second plurality of solder interconnects.