Metal layer plated to inner leads of a leadframe

A semiconductor device comprising:

• a semiconductor element configured as one of a gate driver for driving a switching element or a controller for the gate driver;
• an island lead on which the semiconductor element is mounted;
• a terminal lead electrically connected to the semiconductor element;
• a wire connected to the semiconductor element and the terminal lead;
• and
• a sealing resin covering at least a portion of each of the semiconductor element, the island lead, the terminal lead and the wire,
• wherein the terminal lead includes a base member having an obverse surface facing in a thickness direction of the terminal lead, and a metal layer located between the obverse surface and the wire,
• the base member has a greater bonding strength with respect to the sealing resin than the metal layer,
• the obverse surface includes an opposing side facing the island lead, the opposing side having a first end and a second end that are opposite from each other,
• the obverse surface includes a first portion that includes at least a portion of the opposing side and that is exposed from the metal layer, and
• the first portion is formed by one of a first configuration, a second configuration, and a third configuration, wherein the first configuration includes only a part of the opposing side and only one of the first end and the second end, the second configuration includes only a part of the opposing side and both of the first end and the second end, and the third configuration includes only a part of the opposing side and none of the first end and the second end.