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US 12,616,037 B2Granted
Substrate processing and packaging
AssigneeTexas Instruments Incorporated
InventorsJane Qian Liu, Bradley Morgan Haskett
Life of this patent
Estimating the term…
Abstract
An example ceramic panel has a first surface and a second surface. The ceramic panel has a bond finger well on the first surface of the ceramic panel a scribe line well on the second surface of the ceramic panel. The ceramic panel also has a scribe line along the scribe line well.
Claims18
A method of manufacturing an electronic device, the method comprising:
- forming respective patterns on ceramic sheets to produce patterned ceramic sheets;
- arranging the patterned ceramic sheets to produce a ceramic panel, the ceramic panel having scribe line wells, bond fingers, and contacts;
- forming scribe lines along the scribe line wells of the ceramic panel;
- and
- applying a plating layer to the bond fingers and the contacts of the ceramic panel.
2 more elements
A method of manufacturing an electronic device, the method comprising:
- obtaining a ceramic panel having scribe lines along first scribe line wells on a first side of the ceramic panel, the ceramic panel having second scribe line wells on a second side of the ceramic panel;
- attaching a die to the ceramic panel, after obtaining the ceramic panel having the scribe lines along the first scribe line wells;
- and
- singulating the ceramic panel along the scribe lines along the first scribe line wells.
1 more element
A method comprising:
- obtaining a ceramic panel, the ceramic panel having scribe line wells, bond fingers, and contacts;
- forming scribe lines along the scribe line wells of the ceramic panel, the scribe lines having angled sidewalls;
- and
- applying a plating layer to the bond fingers and the contacts of the ceramic panel, to produce a plated ceramic panel.
1 more element
Dependencies are inferred from the claim text.