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US 12,616,036 B2Granted
Interconnect substrate, method of making the same, and method of identifying interconnect substrate
AssigneeShinko Electric Industries Co., Ltd.
InventorKazuki Wada
Life of this patent
Estimating the term…
Abstract
An interconnect substrate includes an insulating layer, a dispersion layer, and an interconnect layer, the insulating layer, the dispersion layer, and the interconnect layer being laminated together, wherein the dispersion layer includes a main material and one or more fillers dispersed in the main material, the one or more fillers forming a unique dispersion pattern, and wherein the unique dispersion pattern is identifiable by image recognition from outside of the interconnect substrate.
Claims10
An interconnect substrate comprising:
- an insulating layer;
- a dispersion layer;
- and
- an interconnect layer, the insulating layer, the dispersion layer, and the interconnect layer being laminated together,
- wherein the dispersion layer includes a main material and one or more fillers dispersed in the main material, the one or more fillers forming a unique dispersion pattern, and
- wherein the unique dispersion pattern is identifiable by image recognition from outside of the interconnect substrate.
3 more elements
Dependencies are inferred from the claim text.