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US 12,616,033 B2Granted
Multiband QAM interface for slab waveguide
AssigneesTaiwan Semiconductor Manufacturing Company, Ltd., The Regents of the University of California
InventorsHuan-Neng Chen, Chewn-Pu Jou, Feng Wei Kuo, Lan-Chou Cho, Wen-Shiang Liao, Yanghyo Kim
Life of this patent
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Abstract
Systems and methods are provided for an integrated chip. An integrated chip includes a package substrate including a plurality of first layers and a plurality of second layers, each second layer being disposed between a respective adjacent pair of the first layers. A transceiver unit is disposed above the package substrate. A waveguide unit including a plurality of waveguides having top and bottom walls formed in the first layers of the package substrate and sidewalls formed in the second layers of the package substrate.
Claims20
An integrated chip comprising:
- a plurality of waveguides having a length extending in a first direction, arranged along a second direction transverse to the first direction;
- a first coupling unit including a coupler aligned with a top wall of a first waveguide of the plurality of waveguides in the first direction and misaligned with a waveguide opening of the first waveguide in the first direction;
- a second coupling unit including a coupler aligned with the top wall of the first waveguide in the first direction and misaligned with the waveguide opening of the first waveguide in the first direction, wherein the top wall of the first waveguide is disposed between the first and second coupling units and the first and second coupling units define a distance therebetween shorter than a length of a second waveguide of the plurality of waveguides;
- a first shield unit disposed between the first coupling unit and a waveguide opening of the second waveguide and coupled between a transmitter and a top surface of a bottom wall of the first waveguide, wherein the first coupling unit is disposed between the waveguide opening of the first waveguide and the first shield unit;
- and
- a second shield unit disposed between the second coupling unit and the waveguide opening of the second waveguide and coupled between a receiver and the top surface of the bottom wall of the first waveguide, wherein the second coupling unit is disposed between the waveguide opening of the first waveguide and the second shield unit.
3 more elements
An integrated chip comprising:
- a transmitter;
- a receiver;
- a plurality of waveguides having a length extending in a first direction, arranged along a second direction transverse to the first direction;
- a first coupling unit including a coupler aligned with a top wall of a first waveguide of the plurality of waveguides in the first direction and misaligned with a waveguide opening of the first waveguide in the first direction;
- a second coupling unit including a coupler aligned with the top wall of the first waveguide in the first direction and misaligned with the waveguide opening of the first waveguide in the first direction, wherein the top wall of the first waveguide is disposed between the first and second coupling units and the first and second coupling units define a distance therebetween shorter than a length of a second waveguide of the plurality of waveguides;
- a first shield unit disposed between the first coupling unit and a waveguide opening of the second waveguide and coupled between the transmitter and a top surface of a bottom wall of the first waveguide, wherein the first coupling unit is disposed between the waveguide opening of the first waveguide and the first shield unit;
- and
- a second shield unit disposed between the second coupling unit and the waveguide opening of the second waveguide and coupled between the receiver and the top surface of the bottom wall of the first waveguide, wherein the second coupling unit is disposed between the waveguide opening of the first waveguide and the second shield unit.
5 more elements
An integrated chip comprising:
- a transceiver unit disposed above a package substrate and including a transmitter and a receiver;
- a waveguide unit including a plurality of waveguides having a length extending in a first direction, arranged along a second direction transverse to the first direction;
- a first coupling unit including a coupler aligned with a top wall of a first waveguide of the plurality of waveguides in the first direction and misaligned with a waveguide opening of the first waveguide in the first direction;
- a second coupling unit including a coupler aligned with the top wall of the first waveguide in the first direction and misaligned with the waveguide opening of the first waveguide in the first direction, wherein the top wall of the first waveguide is disposed between the first and second coupling units and the first and second coupling units define a distance therebetween shorter than a length of a second waveguide of the plurality of waveguides;
- a first shield unit disposed between the first coupling unit and a waveguide opening of a second waveguide of the plurality of waveguides and coupled between the transmitter and a top surface of a bottom wall of the first waveguide, wherein the first coupling unit is disposed between the waveguide opening of the first waveguide and the first shield unit;
- and
- a second shield unit disposed between the second coupling unit and the waveguide opening of the second waveguide and coupled between the receiver and the top surface of the bottom wall of the first waveguide, wherein the second coupling unit is disposed between the waveguide opening of the first waveguide and the second shield unit.
4 more elements
Dependencies are inferred from the claim text.