Electromagnetic shielding structure, manufacturing method, and communication terminal

A manufacturing method for an electromagnetic shielding structure, comprising the following steps:

• providing a rectangular module substrate, and forming a plurality of ground holes running through the module substrate on all four sides of the rectangular module substrate, so that the plurality of ground holes jointly define an enclosed mounting area or an open mounting area;
• mounting a to-be-shielded component on the module substrate, so that the to-be-shielded component is located in the mounting area of the module substrate;
• disposing a plurality of ground pads in the plurality of ground holes of the module substrate in sequence, and enabling both ends of each ground pad to extend out of the corresponding ground hole;
• dividing a plurality of wires into two groups, wherein two ends of each wire in one group of wires cross over the to-be-shielded component in a first direction and are connected to two ground pads on the upper and lower sides respectively, so that the plurality of wires in the one group are arranged over the to-be-shielded component in the first direction;
• and two ends of each wire in the other group of wires cross over the to-be-shielded component in a second direction and are connected to two ground pads on the left and right sides respectively, so that the plurality of wires in the other group are arranged over the to-be-shielded component in the second direction, thereby jointly forming a grid-like shield layer through the crossing of the two groups of wires to replace additional shielding materials;
• wherein a set included angle α is formed between the first direction and the second direction;
• and
• based on product requirements, adjusting a height of each wire, thereby adjusting a distance between the grid-like shield layer and the to-be-shielded component;
• injection molding a plastic material directly on the module substrate to seal the shield layer and the to-be-shielded component.