Electromagnetic shielding structure
AssigneeAvago Technologies International Sales Pte. Limited
InventorsJin Seong Choi, Hyunsuk Chun, Sampath Karikalan, Kwok Cheung Tsang, Wen Hsien Huang, Hsi-Wei Wang, Chia Yuan Yu
Life of this patent
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Abstract
An EM shielding structure for a semiconductor package is embedded in a through hole of a core layer of the semiconductor package. The EM shielding structure may include multiple vias formed by a copper plating operation. Additionally, a metal way surrounds the EM shielding structures and prevents, along with a dielectric material, unwanted EM radiation (passing through the vias) from emanating throughout the semiconductor package. The EM shielding structure can also take the form of an insert that is adhered to the core layer at a through hole of the core layer.
Claims20
A semiconductor package, comprising:
- a core layer;
- a through hole formed in the core layer;
- and
- an electromagnetic (EM) shielding structure comprising a pre-assembled EM insert adapted to be inserted into the through hole
- wherein the pre-assembled EM insert comprises:
- a dielectric material,
- a first via disposed in the dielectric material, and
- a second via disposed in the dielectric material.
A semiconductor package, comprising:
- a core layer;
- a core through hole formed in the core layer, the core through hole defining a surface;
- and
- a pre-assembled EM insert adapted to be inserted into the core through hole,
- wherein the pre-assembled EM insert comprises:
- a dielectric material disposed in the core through hole, the dielectric material forming a first dielectric through hole and a second dielectric through hole;
- a first metal layer plated to the first dielectric through hole;
- and
- a second metal layer plated to the second dielectric through hole, wherein the first metal layer comprises a first via and the second metal layer comprises a second via.
An electromagnetic (EM) shielding insert for a core of a semiconductor package, the EM shielding insert comprising a pre-assembled EM insert adapted to be inserted into a through hole,
- wherein the pre-assembled EM insert comprises:
- a dielectric material that includes a first through hole and a second through hole;
- a first via disposed in the first through hole;
- a second via disposed in the second through hole;
- and
- a metal layer surrounding the dielectric material.
Dependencies are inferred from the claim text.