Electronic device and method for manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChih-Hsin Lai, Chih-Cheng Lee, Shao-Lun Yang, Wei-Chih Cho
Life of this patent
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Abstract
An electronic device and a method for manufacturing the same are provided. The electronic device includes a substrate, an encapsulant and an electronic component. The encapsulant is disposed over the substrate, and has a first top surface, a second top surface and a first lateral surface extending between the first top surface and the second top surface. A roughness of the first lateral surface is less than or equal to a roughness of the second top surface. The electronic component is disposed over the second top surface of the encapsulant and electrically connected to the substrate.
Claims18
An electronic device comprising:
- a substrate;
- an encapsulant disposed over the substrate, and having a first top surface, a second top surface and a first lateral surface extending between the first top surface and the second top surface, wherein a roughness of the first lateral surface is less than or equal to a roughness of the second top surface;
- and
- an electronic component disposed over the second top surface of the encapsulant and electrically connected to the substrate through a reflowable material, wherein the encapsulant surrounds and contacts the reflowable material, wherein a portion of the reflowable material is disposed over the second top surface of the second portion of the encapsulant.
An electronic device comprising:
- a substrate;
- an encapsulant disposed over the substrate, and including a first portion and a second portion connected to the first portion;
- an electronic component disposed over the second portion;
- and
- a shielding layer disposed on a lateral surface of the second portion, and being distant from the first portion in a cross-sectional view, wherein the second portion defines a recess portion to expose a portion of a reflowable element connecting the substrate and the electronic component.
An electronic device comprising:
- a substrate;
- an encapsulant disposed over the substrate, and including a first portion and a second portion connected to the first portion;
- an electronic component disposed over the second portion;
- and
- a shielding layer disposed on a lateral surface of the second portion, and being distant from the first portion in a cross-sectional view, wherein a bottom end surface of a first portion of the shielding layer is embedded in the first portion of the encapsulant.
Dependencies are inferred from the claim text.