Package structure with stiffener ring having slant sidewall
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChe-Chia Yang, Shu-Shen Yeh, Li-Ling Liao, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng
Life of this patent
Estimating the term…
Abstract
Provided are a package structure and a method of forming the same. The package structure includes a package substrate, a first die, and a stiffener ring. The first die is disposed on the package substrate and has a first sidewall and a second sidewall opposite to each other. The stiffener ring is disposed on the package substrate to surround the first die. The stiffener ring has an inner sidewall facing the first die, and the inner sidewall at least has a slant sidewall facing the first sidewall of the first die.
Claims20
A package structure, comprising:
- a package substrate;
- a first die, disposed on the package substrate and having a first sidewall and a second sidewall opposite to each other;
- and
- a stiffener ring, disposed on the package substrate to surround the first die, wherein the stiffener ring comprises:
- a first portion, adjacent to the first sidewall of the first die;
- and
- a second portion, adjacent to the second sidewall of the first die, wherein an inner sidewall of the first portion has a slant sidewall facing the first sidewall, and an inner sidewall of the second portion has no slant sidewall facing the second sidewall;
- a lid layer, adhered on the stiffener ring by a second adhesive layer, and overlying the first die;
- and
- a first thermal interface material (TIM) disposed only between a top surface of the first die and a bottom surface of the lid layer.
A package structure, comprising:
- a substrate;
- a stiffener ring, disposed on the substrate, wherein the stiffener ring has an inner perimeter to enclose an accommodation area;
- an eccentric die, disposed within the accommodation area on the substrate, wherein the eccentric die is offset from a center of the accommodation area to be close to a first portion of the stiffener ring having an inclined sidewall and away from a second portion of the stiffener ring without any inclined sidewall;
- a lid layer, adhered on the stiffener ring by a second adhesive layer, and overlying the eccentric die;
- and
- a first thermal interface material (TIM) disposed only between a top surface of the eccentric die and a bottom surface of the lid layer.
A package structure, comprising:
- a package substrate;
- a first die, disposed on the package substrate and having a first sidewall and a second sidewall opposite to each other;
- a stiffener ring, disposed on the package substrate to surround the first die, wherein the stiffener ring comprises a first portion adjacent to the first sidewall of the first die and a second portion adjacent to the second sidewall of the first die, wherein the first portion has a topmost area less than a bottommost area thereof, and the second portion has a topmost area substantially equal to a bottommost area thereof;
- a lid layer, adhered on the stiffener ring by a second adhesive layer, and overlying the first die;
- and
- a first thermal interface material (TIM) disposed only between a top surface of the first die and a bottom surface of the lid layer.
Dependencies are inferred from the claim text.