Semiconductor package structures and methods of forming the same

An electronics package, comprising:

• one or more semiconductor dies over an interposer structure and supported by a substrate;
• molding surrounding the one or more semiconductor dies,
• wherein the molding and the interposer structure are on a top surface of the substrate;
• a first ring structure mounted to the top surface of the substrate and surrounding the molding and the interposer structure,
• wherein the first ring structure comprises a plurality of first pieces associated with a first axis and a plurality of second pieces associated with a second axis perpendicular to the first axis,
• wherein the first ring structure is spaced apart from the molding, the interposer structure, and the one or more semiconductor dies in at least one of a direction along the first axis or a direction along the second axis, and
• wherein a top surface of the first ring structure is a greater height with respect to the top surface of the substrate than a top surface of the one or more semiconductor dies;
• and
• a second ring structure over the first ring structure, wherein the second ring structure comprises a single piece.

A structure, comprising:

• a substrate supporting one or more semiconductor dies;
• an interposer on a top surface of the substrate,
• wherein the one or more semiconductor dies are over the interposer;
• a first ring structure mounted to the top surface of the substrate and around the one or more semiconductor dies and the interposer,
• wherein the first ring structure comprises:
• a plurality of first pieces associated with a first axis, and
• a plurality of second pieces associated with a second axis perpendicular to the first axis,
• wherein the first ring structure is spaced apart from the interposer and the one or more semiconductor dies in at least one of a direction along the first axis or a direction along the second axis, and
• wherein a top surface of the first ring structure is a greater height with respect to the top surface of the substrate than a top surface of the one or more semiconductor dies;
• and
• a second ring structure over the first ring structure, wherein the second ring structure comprises a single piece.