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US 12,616,026 B2Granted
Permanent layer for bump chip attach
AssigneeIntel Corporation
InventorsFrederick Atadana, Jean Bosco Kana Kana, Shripad Gokhale, Xavier F. Brun
Life of this patent
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Abstract
Disclosed herein are microelectronics package architectures utilizing glass layers and methods of manufacturing the same. The microelectronics packages may include a silicon layer, dies, and a glass layer. The silicon layer may include vias. The dies may be in electrical communication with vias. The glass layer may include interconnects in electrical communication with the vias.
Claims24
A microelectronics package, comprising:
- a silicon layer comprising:
- a first subset of through vias, and
- a second subset of through vias;
- a first die in electrical communication with the first subset of through vias;
- a second die in electrical communication with the second subset of through vias;
- a glass layer comprising interconnects in electrical communication with the first and second subsets of through vias;
- and
- non-functional bumps.
5 more elements
A microelectronics package, comprising:
- a silicon layer comprising through vias;
- a dummy routing trace in the silicon layer;
- a plurality of dies, wherein each of the plurality of dies is conductively coupled with respective ones of the through vias, and wherein at least one of the plurality of dies is conductively coupled with the dummy routing trace;
- and
- a glass layer comprising interconnects, wherein the interconnects are conductively coupled with the through vias.
2 more elements
A microelectronics package, comprising:
- a silicon layer comprising a first subset of through vias and a second subset of through vias;
- a first die conductively coupled with the first subset of through vias;
- a second die conductively coupled with the second subset of through vias;
- a glass layer comprising interconnects conductively coupled with the first and second subsets of through vias;
- and
- an epoxy between the glass layer and the silicon layer.
3 more elements
Dependencies are inferred from the claim text.