Semiconductor package fixture and methods of manufacturing

A fixture, comprising:

• an interposer;
• a semiconductor die package that is mounted to the interposer and comprising:
• a connector mounted to a substrate;
• and
• an integrated circuit die mounted to the substrate adjacent to a first side of the connector;
• and
• a lid component that is mounted to the interposer and comprising:
• a top structure positioned above the semiconductor die package;
• an access port configured to provide access to the connector;
• a first footing structure extending from the top structure to the interposer;
• and
• a second footing structure extending from the top structure to the interposer,
• wherein the second footing structure is adjacent to a second side of the connector that is opposite the first side, and
• wherein the second footing structure is between the connector and the first footing structure.

A fixture, comprising:

• a semiconductor die package mounted to an interposer,
• wherein the semiconductor die package comprises an optical connector;
• and
• a footing structure of a lid component,
• wherein the footing structure is attached to the interposer, and
• wherein the footing structure comprises:
• a first portion on a first side of the lid component,
• wherein the first portion has a first dimension along a direction;
• and
• a second portion on a second side of the lid component that is opposite the first side,
• wherein the second portion has a second dimension along the direction that is less than the first dimension.