Semiconductor device
AssigneeRenesas Electronics Corporation
InventorsTakayuki Igarashi, Tatsuo Kasaoka, Yasutaka Nakashiba
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Abstract
A semiconductor chip includes a lower wiring layer, a multilayer wiring layer formed on the lower wiring layer, and an upper wiring layer formed on the multilayer wiring layer. Here, a thickness of a wiring provided in the lower wiring layer is larger than a thickness of each of a plurality of wirings provided in the multilayer wiring layer, and a thickness of a wiring provided in the upper wiring layer is larger than the thickness of each of the plurality of wirings provided in the multilayer wiring layer. A lower inductor which is a component of a transformer is provided in the lower wiring layer, and an upper inductor which is a component of the transformer is provided in the upper wiring layer.
Claims15
A semiconductor device comprising:
- a lower wiring layer;
- a multilayer wiring layer formed on the lower wiring layer;
- and
- an upper wiring layer formed on the multilayer wiring layer,
- wherein the lower wiring layer includes a first wiring,
- wherein a second wiring is provided in the multilayer wiring layer,
- wherein a third wiring is provided in the upper wiring layer,
- wherein a thickness of the first wiring is larger than a thickness of the second wiring,
- wherein a thickness of the third wiring is larger than the thickness of the second wiring,
- wherein a lower inductor which is a component of a transformer is provided in the lower wiring layer, and
- wherein an upper inductor which is a component of the transformer is provided in the upper wiring layer.
Dependencies are inferred from the claim text.