Semiconductor device having contact plug
AssigneeMicron Technology, Inc.
InventorsKeiichi Tsuchiya, Keizo Kawakita
Life of this patent
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Abstract
An apparatus that includes a first conductive pattern positioned at a first wiring layer and extending in a first direction, a second conductive pattern positioned at a second wiring layer located above the first wiring layer and extending in a second direction crossing the first direction, and a contact plug connecting the first conductive pattern with the second conductive pattern. The contact plug includes a lower conductive section contacting the first conductive pattern and an upper conductive section contacting the second conductive pattern. A maximum width of the upper conductive section in the first direction is smaller than a maximum width of the lower conductive section in the first direction.
Claims17
An apparatus comprising:
- a first conductive pattern positioned at a first wiring layer and extending in a first direction;
- a second conductive pattern positioned at a second wiring layer located above the first wiring layer and extending in a second direction crossing the first direction;
- a first interlayer insulating film between the first and second wiring layers;
- and
- a contact plug embedded in the first interlayer insulating film and connecting the first conductive pattern with the second conductive pattern,
- wherein the contact plug includes a lower conductive section contacting the first conductive pattern and an upper conductive section contacting the second conductive pattern, and
- wherein a maximum width of the upper conductive section in the first direction is smaller than a maximum width of the lower conductive section in the first direction.
An apparatus comprising:
- a first conductive pattern positioned at a first wiring layer and extending in a first direction;
- a second conductive pattern positioned at a second wiring layer located above the first wiring layer and extending in a second direction crossing the first direction;
- a contact plug connecting the first conductive pattern with the second conductive pattern;
- a first interlayer insulating film located between the first and second wiring layers,
- wherein the contact plug penetrates the first interlayer insulating film;
- and
- a sidewall insulating film located between the first interlayer insulating film and the upper conductive section of the contact plug,
- wherein the contact plug includes a lower conductive section contacting the first conductive pattern and an upper conductive section contacting the second conductive pattern, and
- wherein a maximum width of the upper conductive section in the first direction is smaller than a maximum width of the lower conductive section in the first direction,
- wherein the first interlayer insulating film has a via hole filled with the contact plug and the sidewall insulating film,
- wherein a maximum width of the via hole is greater than a width of the second conductive pattern in the first direction, and
- wherein the lower conductive section of the contact plug is covered with the first interlayer insulating film without the sidewall insulating film interposed therebetween.
An apparatus comprising:
- a first conductive pattern positioned at a first wiring layer and extending in a first direction;
- a second conductive pattern positioned at a second wiring layer located above the first wiring layer and extending in a second direction crossing the first direction;
- an interlayer insulating film located between the first and second wiring layers;
- a contact plug penetrating the interlayer insulating film so as to connect the first conductive pattern with the second conductive pattern, the contact plug including a lower conductive section having a lower surface contacting the first conductive pattern and an upper conductive section having an upper surface contacting the second conductive pattern;
- and
- a sidewall insulating film located between the interlayer insulating film and the upper conductive section of the contact plug,
- wherein the lower conductive section of the contact plug is covered with the interlayer insulating film without the sidewall insulating film interposed therebetween.
Dependencies are inferred from the claim text.