Wafer holding apparatus and method of manufacturing semiconductor device

A semiconductor wafer holding apparatus comprising:

• a Bernoulli chuck having a first surface, a plurality of pads formed on the first surface, and a second surface opposite the first surface;
• and
• a rotating mechanism for rotating the Bernoulli chuck, the rotating mechanism being arranged on the second surface of the Bernoulli chuck,
• wherein a plurality of support parts is formed on the first surface of the Bernoulli chuck at positions each deviated from a center of the first surface,
• wherein, in cross-sectional view, a height of each of the plurality of support parts from the first surface is higher than a height of each of the plurality of pads,
• wherein, on the first surface of the Bernoulli chuck, each of the plurality of pads is surrounded by any three of the plurality of support parts and an edge of the first surface in a plan view such that one of the three is located between each of the plurality of pads and the center of the first surface and a load-presence sensor is located between another one of the three and the center of the first surface, and
• wherein, when the Bernoulli chuck holds a semiconductor wafer, the plurality of pads is not in contact with the semiconductor wafer while the plurality of support parts is in contact with a principal surface of the semiconductor wafer;
• wherein a first image sensor and a first lighting fixture are provided for reading identification information provided on the principal surface of the semiconductor wafer held by the Bernoulli chuck and the first image sensor and a second lighting fixture are used to detect a notch or an orientation flat of the semiconductor wafer held by the Bernoulli chuck.