Substrate processing device and substrate processing method

A substrate processing device comprising:

• a first substrate holder that holds a peripheral portion of a substrate;
• a second substrate holder configured to hold a lower-surface center region of the substrate at a position farther downward than the first substrate holder;
• a rotation driver that rotates the second substrate holder about an axis extending in an up-and-down direction;
• a brush cleaner configured to bring a brush into contact with the lower-surface center region of the substrate held by the first substrate holder to clean the lower-surface center region and bringing the brush into contact with a lower-surface outer region surrounding the lower-surface center region of the substrate held by the second substrate holder to clean the lower-surface outer region;
• an up-and-down mover that performs an up-and-down moving operation of changing a relative positional relationship between the first substrate holder and the substrate by moving at least one of the first substrate holder, the second substrate holder and the substrate in an up-and-down direction;
• and
• a controller, wherein
• the controller, in a case in which cleaning processing is performed on the substrate, by controlling the first substrate holder, the second substrate holder, the rotation driver, the brush cleaner and the up-and-down mover,
• causes the brush cleaner to clean a lower-surface center region of the substrate held by the first substrate holder while rotating the second substrate holder,
• stops rotation of the second substrate holder for transfer of the substrate from the first substrate holder to the second substrate holder after the lower-surface center region of the substrate is cleaned,
• causes the up-and-down mover to perform the up-and-down moving operation for transfer of the substrate from the first substrate holder to the second substrate holder after the lower-surface center region of the substrate is cleaned,
• causes the brush cleaner to clean the lower-surface outer region of the substrate held by the second substrate holder while rotating the second substrate holder after the substrate is transferred from the first substrate holder to the second substrate holder, and
• until the substrate is transferred to the second substrate holder after the lower-surface center region of the substrate is cleaned, a rotation stop operation for the second substrate holder and the up-and-down moving operation are performed such that a period for the rotation stop operation and a period for the up-and-down moving operation at least partially overlap with each other.

A substrate processing method with use of a substrate processing device,

• the substrate processing device comprising:
• a first substrate holder that holds a peripheral portion of a substrate;
• a second substrate holder configured to hold a lower-surface center region of the substrate and rotate the substrate at a position farther downward than the first substrate holder;
• and
• a horizontal mover that performs a horizontal moving operation of changing a relative positional relationship between the first substrate holder and the second substrate holder in a horizontal plane;
• and
• the substrate processing method including:
• bringing a brush into contact with the lower-surface center region of the substrate held by the first substrate holder while rotating the second substrate holder to clean the lower-surface center region of the substrate;
• stopping rotation of the second substrate holder for transfer of the substrate from the first substrate holder to the second substrate holder after the lower-surface center region of the substrate is cleaned;
• causing the horizontal mover to perform the horizontal moving operation for transfer of the substrate from the first substrate holder to the second substrate holder after the lower-surface center region of the substrate is cleaned;
• and
• bringing the brush into contact with a lower-surface outer region surrounding the lower-surface center region of the substrate held by the second substrate holder while rotating the second substrate holder to clean the lower-surface outer region of the substrate after the substrate is transferred from the first substrate holder to the second substrate holder, wherein
• until the substrate is transferred to the second substrate holder after the lower-surface center region of the substrate is cleaned, the stopping rotation of the second substrate holder and the causing the horizontal mover to perform the horizontal moving operation are started such that a period for a rotation stop operation for the second substrate holder and a period for the horizontal moving operation at least partially overlap with each other.

A substrate processing method with which a substrate processing device is used,

• the substrate processing device comprising:
• a first substrate holder that holds a peripheral portion of a substrate;
• a second substrate holder configured to hold a lower-surface center region of the substrate and rotate the substrate at a position farther downward than the first substrate holder;
• and
• an up-and-down mover that performs an up-and-down moving operation of changing a relative positional relationship between the first substrate holder and the substrate by moving at least one of the first substrate holder, the second substrate holder and the substrate in an up-and-down direction;
• and
• the substrate processing method including:
• bringing a brush into contact with the lower-surface center region of the substrate held by the first substrate holder while rotating the second substrate holder to clean the lower-surface center region of the substrate;
• stopping rotation of the second substrate holder for transfer of the substrate from the first substrate holder to the second substrate holder after the lower-surface center region of the substrate is cleaned;
• causing the up-and-down mover to perform the up-and-down moving operation for transfer of the substrate from the first substrate holder to the second substrate holder after the lower-surface center region of the substrate is cleaned;
• and
• bringing the brush into contact with a lower-surface outer region surrounding the lower-surface center region of the substrate held by the second substrate holder while rotating the second substrate holder to clean the lower-surface outer region of the substrate after the substrate is transferred from the first substrate holder to the second substrate holder, wherein
• until the substrate is transferred to the second substrate holder after the lower-surface center region of the substrate is cleaned, the stopping rotation of the second substrate holder and the causing the up-and-down mover to perform the up-and-down moving operation are started such that a period for a rotation stop operation for the second substrate holder and a period for the up-and-down moving operation at least partially overlap with each other.