Semiconductor wafer cleaning apparatus
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChia-Lun Chen, Po-Jen Shih, Ming-Sung Hung, Wen-Hung Hsu
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Abstract
A semiconductor wafer cleaning apparatus is provided. The semiconductor wafer cleaning apparatus includes a spin base, a spindle extending through the spin base, and a clamping member covering the spin base. The spindle includes a mounting part and a supporting part disposed on the mounting part. The mounting part includes an inner projection, the supporting part includes a conical projection, and the conical projection is surrounded by the inner projection. The semiconductor wafer cleaning apparatus further includes a first sealing ring disposed between the spin base and the mounting part.
Claims20
A semiconductor wafer cleaning apparatus, comprising:
- a spin base;
- a spindle extending through the spin base;
- a clamping member covering the spin base, comprising a mounting part and a supporting part disposed on the mounting part, wherein the mounting part comprises an inner projection, the supporting part comprises a conical projection and an outer projection, the conical projection is surrounded by the inner projection, and the outer projection surrounding the conical projection and the inner projection;
- and
- a first sealing ring disposed between the spin base and the mounting part.
A semiconductor wafer cleaning apparatus, comprising:
- a spin base;
- a spindle extending through the spin base;
- a clamping member covering the spin base, comprising a mounting part and a supporting part disposed on the mounting part, wherein the mounting part comprises a base plate and an inner projection protruding from the base plate, and the supporting part comprises an outer projection surrounding the mounting part;
- and
- a sealing ring disposed between the mounting part and the supporting part, wherein the base plate and the inner projection are in contact with different sides of the sealing ring, and the sealing ring and the base plate are in contact with the outer projection.
A semiconductor wafer cleaning apparatus, comprising:
- a spin base, comprising a bottom and a flange protruding from the bottom;
- a spindle extending through the spin base;
- a clamping member covering the spin base and comprising a mounting part and a supporting part, wherein the mounting part comprises a base plate, the supporting part comprises a conical projection and an outer projection, and the outer projection surrounds the mounting part and the conical projection;
- and
- a first sealing ring disposed under the base plate, wherein the first sealing ring is in contact with the flange and spaced apart from the bottom.
Dependencies are inferred from the claim text.