Substrate processing apparatus and system including the same

A system for processing a substrate, the system comprising:

• a substrate processing apparatus;
• and
• a transfer part configured to bring the substrate into the substrate processing apparatus to perform the processing process and bring the substrate out of the substrate processing apparatus when the processing process is completed,
• wherein the substrate processing apparatus comprises:
• a chamber having a processing space in which substrate processing is performed therein;
• one or more exhaust lines connected to the chamber and configured to discharge a processing fluid from the processing space to an outside of the chamber;
• a supporting chuck disposed in the processing space, configured to support the substrate from below so that the substrate is disposed on an upper portion of the supporting chuck, and having an inner space configured to accommodate a first processing fluid;
• and
• one or more first supply lines configured to receive the first processing fluid from the outside of the chamber and transfer the first processing fluid to the inner space of the supporting chuck,
• wherein the supporting chuck comprises one or more discharge holes formed in a lower surface of the supporting chuck and configured to discharge the first processing fluid accommodated in the inner space of the supporting chuck downwardly to the processing space.

An apparatus for processing a substrate, the apparatus comprising:

• a chamber having a processing space in which substrate processing is performed therein;
• one or more exhaust lines connected to the chamber and configured to discharge a processing fluid from the processing space to an outside of the chamber;
• a supporting chuck disposed in the processing space, configured to support the substrate from below so that the substrate is disposed on an upper portion of the supporting chuck, and having an inner space configured to accommodate a first processing fluid;
• one or more first supply lines configured to receive the first processing fluid from the outside of the chamber and transfer the first processing fluid to the inner space of the supporting chuck;
• one or more second supply lines extending from an upper surface of the processing space and configured to directly spray a second processing fluid from the outside of the chamber to the processing space;
• and
• one or more third supply lines extending from a lower surface of the processing space and configured to directly spray a third processing fluid from the outside of the chamber to the processing space,
• wherein the supporting chuck comprises one or more discharge holes formed to be open in a direction opposite to the supported substrate and configured to spray the first processing fluid accommodated in the inner space to the processing space.