Substrate processing apparatus, non-transitory computer-readable recording medium, substrate processing method and method of manufacturing semiconductor device

A non-transitory computer-readable recording medium storing a program that causes, by a computer, a substrate processing apparatus to perform:

• (a) placing a dummy substrate on each of a plurality of substrate placing surfaces in the substrate processing apparatus, wherein the substrate processing apparatus comprises:
• a substrate support where the plurality of substrate placing surfaces, on each of which a product substrate is placed, are arranged in a concentric manner;
• a process gas supplier through which a process gas is supplied to the plurality of substrate placing surfaces while the product substrate is placed thereon and the substrate support is rotated;
• a cleaning gas supplier through which a cleaning gas is supplied to the plurality of substrate placing surfaces while the dummy substrate is placed on each substrate placing surface;
• and a rotator configured to rotate the substrate support, wherein the dummy substrate is configured such that an outer peripheral portion of the dummy substrate is out of contact with each substrate placing surface in a state where the dummy substrate is placed on each substrate placing surface, the outer peripheral portion of the dummy substrate is provided with a plurality of through-holes penetrating from a front surface thereof to a back surface thereof, a width of a region of the outer peripheral portion of the dummy substrate closer to an exhaust buffer structure provided at an outer periphery of the substrate support is greater than that of a region of the outer peripheral portion of the dummy substrate closer to a center of the substrate support, and the cleaning gas is supplied to the plurality of substrate placing surfaces via the plurality of through-holes of the dummy substrate while the dummy substrate is placed on each substrate placing surface;
• (b) exhausting the process gas through the exhaust buffer structure;
• and
• (c) supplying the cleaning gas through the cleaning gas supplier.

A substrate processing method comprising:

• (a) placing a dummy substrate on each of a plurality of substrate placing surfaces in a substrate processing apparatus, wherein the substrate processing apparatus comprises:
• a substrate support having the plurality of substrate placing surfaces, on each of which a product substrate is placed, are arranged in a concentric manner;
• a process gas supplier through which a process gas is supplied to the plurality of substrate placing surfaces while the product substrate is placed thereon and the substrate support is rotated;
• a cleaning gas supplier through which a cleaning gas is supplied to the plurality of substrate placing surfaces while the dummy substrate is placed on each substrate placing surface;
• and a rotator configured to rotate the substrate support, wherein the dummy substrate is configured such that an outer peripheral portion of the dummy substrate is out of contact with each substrate placing surface in a state where the dummy substrate is placed on each substrate placing surface, the outer peripheral portion of the dummy substrate is provided with a plurality of through-holes penetrating from a front surface thereof to a back surface thereof, a width of a region of the outer peripheral portion of the dummy substrate closer to an exhaust buffer structure provided at an outer periphery of the substrate support is greater than that of a region of the outer peripheral portion of the dummy substrate closer to a center of the substrate support, and the cleaning gas is supplied to the plurality of substrate placing surfaces via the plurality of through-holes of the dummy substrate while the dummy substrate is placed on each substrate placing surface;
• (b) exhausting the process gas through the exhaust buffer structure;
• and
• (c) supplying the cleaning gas through the cleaning gas supplier.