Semiconductor member manufacturing method

A semiconductor member manufacturing method comprising:

• a laser processing step of forming a converging spot of laser light in an object including a semiconductor while relatively moving the converging spot with respect to the object along a line extended in a circular shape when viewed from a Z direction intersecting with an incident surface of the laser light in the object, thereby forming a modified region and a fracture extended from the modified region along the line in the object;
• and
• a separation step of, after the laser processing step, separating a part of the object using the modified region and the fracture as a boundary, thereby forming a semiconductor member from the object,
• wherein
• the laser processing step includes a first processing step of relatively moving the converging spot with respect to the object along the line, thereby forming a first modified region along the line as the modified region and a first fracture extended from the first modified region as the fracture,
• in the first processing step, the first fracture that is inclined with respect to the Z direction in an intersecting plane intersecting with the line is formed,
• in the separation step, the semiconductor member including an inclined surface defined by the first fracture as an outer side surface is formed, and
• the first processing step includes:
• a first forming step of relatively moving the converging spot along the line while setting a position of the converging spot in the Z direction at a first Z position, thereby forming a fourth modified region as the first modified region;
• and
• a second forming step of relatively moving the converging spot along the line while setting a position of the converging spot in the Z direction at a second Z position that is closer to the incident surface side than the first Z position, thereby forming a fifth modified region as the first modified region, and forming the first fracture extended from the fifth modified region,
• and wherein
• in the first forming step, a position of the converging spot in a Y direction intersecting with an X direction that is a direction in which the converging spot is relatively moved and the Z direction is set at a first Y position, and
• in the second forming step, a position of the converging spot in the Y direction is set at a second Y position shifted from the first Y position, while the laser light is modulated such that a beam shape of the converging spot in a YZ plane including the Y direction and the Z direction has an inclined shape that is inclined in a direction of the shift at least on the incident surface side with respect to a center of the converging spot, thereby forming the first fracture so as to be inclined in the direction of the shift in the YZ plane.