Non-contact processing device and processing method including modification energy and separation energy

A non-contact processing method for performing a processing procedure on at least one solid structure, comprising following steps of:

• performing a modification step of the processing procedure, the modification step using a modification energy source for providing a modification energy to a processing target area of the solid structure to generate qualitative changes or defects in the processing target area of the solid structure, thereby causing the processing target area becoming a modified layer, wherein the modification energy source is a laser source, the modification energy is a laser energy;
• and
• performing a separation step of the processing procedure, the separation step using a separation energy source for applying a separation energy on the solid structure with the modified layer in a non-contact manner, thereby separating or thinning the solid structure at the modified layer and causing the solid structure becoming a separated or thinned solid structure, wherein the separation energy source comprises an electrical discharge machining (EDM) unit for providing a discharge energy as the separation energy via at least one discharge electrode.