Mass-transfer method and mass-transfer device for micro semiconductor chips

A mass-transfer method of mass-transferring a plurality of micro semiconductor chips, the mass-transfer method comprising:

• mass-transferring a plurality of first micro semiconductor chips onto a first substrate such that the plurality of first micro semiconductor chips are disposed in a plurality of first grooves of the first substrate;
• determining whether an empty first groove is present in the first substrate, wherein the plurality of first micro semiconductor chips are not disposed in the plurality of first grooves;
• and
• positioning a second micro semiconductor chip in the empty first groove, wherein the second micro semiconductor chip is identical to a first micro semiconductor chip from among the plurality of first micro semiconductor chips,
• wherein the positioning comprises:
• transferring a plurality of second micro semiconductor chips onto a second substrate separate from the first substrate, wherein the second micro semiconductor chip is included in the plurality of second micro semiconductor chips;
• adsorbing the second micro semiconductor chip from the second substrate;
• and
• positioning the adsorbed second micro semiconductor chip in the empty first groove, using an electrostatic force or an electromagnetic force.