Semiconductor device and method of manufacturing the same
AssigneeFuji Electric Co., Ltd.
InventorsRyouichi Kawano, Motoyoshi Kubouchi
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AssigneeFuji Electric Co., Ltd.
InventorsRyouichi Kawano, Motoyoshi Kubouchi
Estimating the term…
A semiconductor device includes: a semiconductor substrate of a first conductivity-type; an insulated gate electrode structure buried in a first trench provided in the semiconductor substrate; a base region of a second conductivity-type provided in the semiconductor substrate so as to be in contact with the first trench; a first main electrode region of the first conductivity-type provided at an upper part of the base region so as to be in contact with the first trench; a polysilicon film of the second conductivity-type having a higher impurity concentration than the base region and buried in a second trench provided in the semiconductor substrate so as to be in contact with the base region; and a second main electrode region provided on a bottom surface side of the semiconductor substrate.
A semiconductor device comprising:
A method of manufacturing a semiconductor device, comprising
Dependencies are inferred from the claim text.