Power converter
AssigneeFuji Electric Co., Ltd.
InventorMengyu Li
Life of this patent
Estimating the term…
Abstract
A power converter includes a semiconductor module with a switching element, a DC terminal, and an AC terminal, and includes a capacitor module with a capacitor terminal coupled to the DC terminal of the semiconductor module. The power converter includes a cooling module. The cooling module has a first cooling surface provided to face the heat dissipation portion, and has a second cooling surface provided to face the DC terminal or the capacitor terminal. The cooling module has a third cooling surface extending in a direction intersecting each of the first cooling surface and the second cooling surface, the third cooling surface being configured to cool the capacitor module.
Claims8
A power converter comprising:
- a semiconductor module including a switching element, a DC terminal, an AC terminal, and a heat dissipation portion;
- a capacitor module including a capacitor terminal coupled to the DC terminal of the semiconductor module;
- and
- a cooling module having
- a first cooling surface provided to face the heat dissipation portion,
- a second cooling surface provided to face the DC terminal or the capacitor terminal, and
- a third cooling surface extending in a direction intersecting each of the first cooling surface and the second cooling surface, the third cooling surface being configured to cool the capacitor module,
- wherein the first cooling surface and the second cooling surface are coplanar, and define a first module surface of the cooling module, and
- wherein the third cooling surface defines a second module surface of the cooling module, the second module surface being adjacent to and perpendicular to the first module surface.
A power converter comprising:
- a semiconductor module including a switching element, a first DC terminal, a second DC terminal, an AC terminal, and a heat dissipation portion;
- a capacitor module including
- a first capacitor terminal coupled to the first DC terminal, and
- a second capacitor terminal coupled to the second DC terminal;
- and
- a cooling module including a lower cooling part and an upper cooling part, the lower cooling part having
- a first cooling surface provided to face the heat dissipation portion of the semiconductor module,
- a second cooling surface provided to face any one of the first DC terminal, the second DC terminal, the first capacitor terminal, and the second capacitor terminal, and
- a third cooling surface extending in a direction intersecting each of the first cooling surface and the second cooling surface, the third cooling surface being configured to cool the capacitor module,
- wherein the first capacitor terminal, the first DC terminal, the second capacitor terminal, and the second DC terminal are arranged between the lower cooling part and the upper cooling part,
- wherein the first cooling surface and the second cooling surface are coplanar, and define a first module surface at the lower cooling part of the cooling module, and
- wherein the third cooling surface defines a second module surface at the lower cooling part of the cooling module, the second module surface being adjacent to and perpendicular to the first module surface.
Dependencies are inferred from the claim text.