Cooling pipe and cooling assembly and electronic device including the same

A cooling assembly, configured for at least one electronic module, comprising:

• at least one thermally conductive plate, configured to be attached on one surface of the at least one electronic module, wherein the at least one thermally conductive plate is configured to be flexible such that there is no air gap formed between the at least one thermally conductive plate and surfaces of the at least one electronic module;
• and
• at least one cooling pipe, configured to be in thermal contact with one side of the at least one thermally conductive plate located farther away from the at least one electronic module, wherein the at least one cooling pipe comprising a pipe wall, wherein the pipe wall surrounds and forms a fluid channel, and a material of the pipe wall of the at least one cooling pipe comprises high-density polyethylene;
• wherein the pipe wall of the at least one cooling pipe has a thermally conductive characteristic, and the pipe wall of the at least one cooling pipe made of high-density polyethylene is repeatedly elastically deformable in response to a pressure variation in the fluid channel;
• wherein a contact area between the pipe wall of the at least one cooling pipe and the at least one thermally conductive plate is proportional to a pressure in the fluid channel, and wherein in an expanded state of the pipe wall, the contact area eliminates thermal resistance caused by air gaps.