Wiring board, manufacturing method, electronic module, electronic unit, and electronic device
AssigneeCanon Kabushiki Kaisha
InventorsYu Ogawa, Toshiyuki Yoshida
Life of this patent
Estimating the term…
Abstract
A wiring board includes a wiring layer, a shield layer, and an insulating layer. The wiring layer includes at least one signal line and at least one ground line. The shield layer overlaps the wiring layer in plan view. The insulating layer is provided between the wiring layer and the shield layer. The insulating layer includes at least one end portion surrounded by the insulating layer. The at least one end portion is located on at least the at least one ground line. A connection conductor line electrically connecting the shield layer to the at least one ground line is provided on part of the at least one end portion.
Claims20
A wiring board comprising:
- a wiring layer including at least one signal line and at least one ground line;
- a shield layer that overlaps the wiring layer in plan view;
- and
- an insulating layer provided between the wiring layer and the shield layer,
- wherein the insulating layer includes at least one end portion surrounded by the insulating layer,
- wherein the at least one end portion is located on at least the at least one ground line, and
- wherein a connection conductor line configured to electrically connect the shield layer to the at least one ground line is provided on part of the at least one end portion.
A wiring board comprising:
- a wiring layer including a signal line and a ground line;
- a shield layer that overlaps the wiring layer in plan view;
- and
- an insulating layer provided between the wiring layer and the shield layer,
- wherein the insulating layer includes a certain end portion that surrounds the insulating layer,
- wherein the certain end portion is located on at least the ground line, and
- wherein a connection conductor line configured to electrically connect the shield layer to the ground line is provided on part of the certain end portion.
Dependencies are inferred from the claim text.