Multi-embedded circuit board

A multi-embedded circuit board comprising:

• a first circuit board comprising:
• a substrate;
• a power amplifier within the substrate, the power amplifier electrically coupled to one or more electromagnetic signal interfaces;
• and
• one or more waveguide launchers within the substrate and electrically coupled to the power amplifier;
• and
• a first cold plate thermally coupled to the first circuit board, the first cold plate comprising one or more first cooling elements configured to extract heat from the power amplifier.

A multi-embedded circuit board comprising:

• a plurality of circuit boards stacked one on another, at least one of the circuit boards of the plurality of circuit boards being configured so as to have a different processing function than another processing function of another circuit board of the plurality of circuit boards;
• an interconnection join layer disposed between adjacent circuit boards of the plurality of circuit boards, wherein the interconnection join layer is physically coupled to the adjacent circuit boards and includes vias that extend through the interconnection join layer to electrically couple the adjacent circuit boards to each other so as to form an integrated circuit board module having a predetermined electromagnetic communication characteristic;
• a first cold plate coupled to an end of the integrated circuit board module;
• and
• a power amplification layer coupled to the first cold plate, the power amplification layer communicatively coupled to the integrated circuit board module by one or more waveguides that extend through the first cold plate.