Switching power converter module with a heat dissipation structure

A method of forming an electronic device, the method comprising:

• providing a printed circuit board (PCB) having a first surface and a second surface opposite the first surface, wherein the PCB includes a thermally conductive region having a plurality of vias that extend from the first surface to the second surface;
• attaching a semiconductor device to the second surface of the PCB, the semiconductor device underlying the thermally conductive region;
• providing transformer having a magnetic core;
• providing a shield arranged to partially enclose the transformer, the shield defining an opening and attached to the first surface of the PCB;
• disposing an insert within the opening;
• and
• attaching the insert to the first surface of the PCB, wherein the insert is disposed in a region overlying the thermally conductive region.

An electronic device comprising:

• a printed circuit board (PCB) having a first surface and a second surface opposite the first surface, wherein the PCB includes a thermally conductive region having a plurality of vias that extend from the first surface to the second surface;
• a semiconductor device attached to the second surface of the PCB and underlying the thermally conductive region;
• a transformer having a magnetic core;
• a shield arranged to partially enclose the transformer and define an opening;
• an insert disposed within the opening, attached to the first surface of the PCB and overlying the thermally conductive region;
• and
• wherein:
• the shield is disposed on a first side of the PCB;
• and
• the semiconductor device is disposed on a second side of the PCB that is opposite the first side.