Covering structure, sound producing package and manufacturing method of sound producing package
AssigneeXmems Taiwan Co., Ltd.
InventorWei-Yang Li
Life of this patent
Estimating the term…
Loading patent…
AssigneeXmems Taiwan Co., Ltd.
InventorWei-Yang Li
Estimating the term…
A covering structure disposed within a sound producing package includes a tube structure, a first chamber and a first connecting structure. The tube structure has a first sound opening and a second sound opening, wherein a tube cavity connected between the first sound opening and the second sound opening exists inside the tube structure. A first cavity exists inside the first chamber and is connected to the tube cavity of the tube structure. The first connecting structure is connected between the tube structure and the first chamber, wherein the first connecting structure is between the first sound opening and the second sound opening, and the first cavity of the first chamber is connected to the tube cavity of the tube structure through the first connecting structure. An acoustic pathway of the covering structure is formed between the first sound opening and the second sound opening.
A covering structure, disposed within a sound producing package, the covering structure comprising:
A sound producing package, comprising:
A manufacturing method of a sound producing package, comprising:
A covering structure, disposed within a sound producing package, the covering structure comprising:
A covering structure, disposed within a sound producing package, the covering structure comprising:
Dependencies are inferred from the claim text.