Image capturing module for reducing overall thickness and portable electronic device for using the same

An image capturing module for reducing overall thickness, comprising:

• a circuit substrate having an upper surface, a lower surface and a through opening connected between the upper surface and the lower surface;
• an image sensing chip disposed in the through opening of the circuit substrate and electrically connected to the circuit substrate through a plurality of metal wires;
• an insulating connection structure disposed in the through opening of the circuit substrate and connected between the image sensing chip and the circuit substrate;
• and
• a lens assembly including a lens holder disposed on the circuit substrate and a lens module carried by the lens holder;
• wherein the image sensing chip has an image sensing area disposed on an upper surface thereof and corresponding to the lens module;
• wherein a lower surface of the image sensing chip is exposed outside the circuit substrate and not covered by the insulating connection structure;
• wherein the insulating connection structure includes a bottom surrounding insulating layer and a top surrounding insulating layer connected to the bottom surrounding insulating layer.

A portable electronic device configured to use an image capturing module, characterized in that the image capturing module includes:

• a circuit substrate having an upper surface, a lower surface and a through opening connected between the upper surface and the lower surface;
• an image sensing chip disposed in the through opening of the circuit substrate and electrically connected to the circuit substrate through a plurality of metal wires;
• an insulating connection structure disposed in the through opening of the circuit substrate and connected between the image sensing chip and the circuit substrate;
• and
• a lens assembly including a lens holder disposed on the circuit substrate and a lens module carried by the lens holder;
• wherein the image sensing chip has an image sensing area disposed on an upper surface thereof and corresponding to the lens module;
• wherein a lower surface of the image sensing chip is exposed outside the circuit substrate and not covered by the insulating connection structure;
• wherein the insulating connection structure includes a bottom surrounding insulating layer and a top surrounding insulating layer connected to the bottom surrounding insulating layer.