Electrical operating means having an insulation system, and method for producing the insulation system
AssigneeSiemens Aktiengesellschaft
InventorsJürgen Huber, Steffen Lang, Niels Müller, Matthias Übler
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Abstract
Various embodiments include an electrical operating medium having an insulation system comprising a main insulation in the form of an encapsulation by an encapsulating compound. The encapsulating compound comprises the following components: a carbon-based resin component A; a silicon/oxygen-based resin component B; where the ratio of the components A:B is in the range between A=99:B=1 to A=60:B=40; 0.1% to 10% by weight of catalyst; 30% to 85% by weight of dielectric filler; and 0-60% by weight of a curing agent.
Claims13
An electrical operating medium having an insulation system comprising a main insulation in the form of an encapsulation by an encapsulating compound, wherein the encapsulating compound comprises the following components:
- A) a carbon-based resin component A;
- B) a silicon/oxygen-based resin component B;
- where the ratio of the components A:B is in the range between A=99:B=1 to A=60:B=40;
- C) 0.1% to 10% by weight of catalyst;
- D) 30% to 85% by weight of dielectric filler;
- and
- E) 0-60% by weight of a curing agent;
- wherein the resin component B includes —CR2— units wherein “R” is selected from the group consisting of:
- alkyl with a homolog having 12 carbon atoms, alkenyl, vinyl, styrene, aryl, oxygen-containing heterocycles, dioxane, nitrogen-containing heterocycles, sulfur-substituted aryls, and alkyls.
A process for producing an electrical operating medium having an insulation system comprising a main insulation or parts of a in the form of an encapsulation by an encapsulating compound, the process comprising:
- encapsulating an electrical conductor;
- wherein the encapsulating compound includes:
- A) a carbon-based resin component A;
- B) a silicon/oxygen resin component B, wherein a ratio of A:B is in the range between A=99:B=1 to A=60:B=40;
- C) 0.1% to 10% by weight of catalyst;
- D) 30% to 85% by weight of dielectric filler;
- and
- E) 0-60% by weight of a curing agent
- wherein the resin component B includes —CR2— units wherein “R” is selected from the group consisting of:
- alkyl with a homolog having 12 carbon atoms, alkenyl, vinyl, styrene, aryl, oxygen-containing heterocycles, dioxane, nitrogen-containing heterocycles, sulfur-substituted aryls and/or alkyls.
Dependencies are inferred from the claim text.