Antenna device
AssigneeAUO Corporation
InventorsYu-Chih Wang, Chung-Hung Chen, Yi-Cheng Lai, Shih-Hsien Yang
Life of this patent
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Abstract
An antenna device includes a transparent substrate and a plurality of antenna units arranged on the transparent substrate. Each antenna unit includes an antenna electrode, a ground electrode, a thin-film circuit structure, a redistribution structure and a chip. The redistribution structure includes a digital signal pad, an analog signal pad, a radio frequency (RF) signal pad, and an antenna signal pad. The chip is bonded to the digital signal pad, the analog signal pad, the RF signal pad, and the antenna signal pad. The digital signal pad and the analog signal pad are disposed in a first bonding area. The RF signal pad and the antenna signal pad are disposed in a second bonding area.
Claims11
An antenna device, comprising:
- a transparent substrate;
- a plurality of antenna units disposed on the transparent substrate, wherein each of antenna units comprises:
- an antenna electrode disposed on a first surface of the transparent substrate;
- a ground electrode disposed on a second surface of the transparent substrate opposite to the first surface;
- a thin-film circuit structure disposed on the ground electrode and comprising a digital signal line;
- a redistribution structure disposed on the thin-film circuit structure and comprising:
- a digital signal pad electrically connected to the digital signal line;
- an analog signal line and an analog signal pad electrically connected to the analog signal line;
- a radio frequency (RF) signal line and a radio frequency (RF) signal pad electrically connected to the RF signal line;
- and
- an antenna signal pad electrically connected to the antenna electrode;
- and
- a chip bonded to the digital signal pad, the analog signal pad, the RF signal pad, and the antenna signal pad, wherein the digital signal pad and the analog signal pad are disposed in a first bonding area, and the RF signal pad and the antenna signal pad are disposed in a second bonding area separated from the first bonding area.
An antenna device, comprising:
- a transparent substrate;
- a plurality of antenna units disposed on the transparent substrate, wherein each of antenna units comprises:
- an antenna electrode disposed on a first surface of the transparent substrate;
- a ground electrode disposed on a second surface of the transparent substrate opposite to the first surface;
- a thin-film circuit structure disposed on the ground electrode;
- a redistribution structure disposed on the thin-film circuit structure and comprising:
- a first ground structure and a second ground structure separated from each other and overlapping with the ground electrode;
- an insulating layer disposed on the first ground structure and the second ground structure;
- and
- a first pad and a second pad disposed on the insulating layer, wherein the first pad overlaps with a first opening of the first ground structure, and the second pad overlaps with a second opening of the second ground structure, wherein the first ground structure and the first pad overlap with a first bonding area, and the second ground structure and the second pad overlap with a second bonding area that is separated from the first bonding area;
- and
- a chip overlapping with the first bonding area and the second bonding area, and bonded to the first pad and the second pad.
Dependencies are inferred from the claim text.