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US 12,614,702 B2Granted
Substrate processing apparatus and a method of processing a substrate using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsChangbae Park, Ki-Il Kim, Jongchul Park, Jae Sik An, Suntaek Lim
Life of this patent
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Abstract
A substrate processing apparatus includes a process chamber providing a process space, a stage configured to support a substrate, a gas injection unit spaced upward from the stage in the process space, and a spin polarizer having a ring shape and spaced upward from the stage. The spin polarizer includes a polarizer body having a ring shape, and a thin layer on a surface of the polarizer body. The thin layer includes a ferromagnetic material.
Claims16
A substrate processing apparatus, comprising:
- a process chamber providing a process space;
- a stage configured to support a substrate;
- a gas injection unit spaced upward from the stage in the process space;
- and
- a spin polarizer having a ring shape and spaced upward from the stage,
- wherein the spin polarizer comprises:
- a polarizer body having a ring shape;
- and
- a thin layer on a surface of the polarizer body, and
- wherein the thin layer comprises a ferromagnetic material.
7 more elements
A substrate processing apparatus, comprising:
- a process chamber providing a process space;
- a stage configured to support a substrate;
- a gas injection unit spaced upward from the stage in the process space;
- a radio frequency (RF) power source electrically coupled with the stage and configured to supply alternating current (AC) power to the stage;
- and
- a spin polarizer on an edge of the stage and spaced upward from the stage,
- wherein the spin polarizer comprises:
- a polarizer body;
- and
- a thin layer at least partially surrounding at least one of an inner surface, a top surface, and a bottom surface of the polarizer body.
7 more elements
Dependencies are inferred from the claim text.