Multilayer electronic component
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsHye Jin Park, Hong Je Choi, Ji Hye Han, Byung Woo Kang, Su Yun Yun, Sang Wook Lee, Jung Min Kim
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AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsHye Jin Park, Hong Je Choi, Ji Hye Han, Byung Woo Kang, Su Yun Yun, Sang Wook Lee, Jung Min Kim
Estimating the term…
An example embodiment of the present disclosure provides a multilayer electronic component including an external electrode including an electrode layer and a conductive resin layer disposed on the electrode layer. The conductive resin layer includes conductive particles including at least one of Cu particles, Cu3Sn and Cu6Sn5, and a resin, and in cross-sections of the conductive resin layer, a ratio of an area occupied by Cu3Sn to the total area occupied by the Cu particles, Cu3Sn, and Cu6Sn5 is 1.88% to 38.89%, and a ratio of an area occupied by Cu6Sn5 to the total area occupied by the Cu particles, Cu3Sn and Cu6Sn5 is 31.54% to 97.23%.
A multilayer electronic component, comprising:
A multilayer electronic component, comprising:
Dependencies are inferred from the claim text.